25th High Performance Computing Symposium (HPC 2017)

April 23 - 26, 2017 | Virginia Beach Conference Center | Virginia Beach, VA, USA

part of the SCS Spring Simulation Multi-Conference (SpringSim'17) co-located with MODSIM World in cooperation with ACM/SIGSIM
SpringSim paper submission system for HPC 2017 is now open, also to authors who did not submit an abstract. Please, use the new paper kit.

Call for Papers

Abstract submission October 15, 2016
Abstract feedback October 30, 2016
(Submission of abstract not compulsory)
Full paper submission January 9, 2017
December 15, 2016
(The submission of full papers is open also to authors who did not previously submit an abstract)
Notification of acceptance January 31, 2017
Camera-ready paper February 20, 2017
(Note that there is a new paper kit this year)

GENERAL INFORMATION

The 2017 Spring Simulation Multi-Conference will feature the 25th High Performance Computing Symposium (HPC 2017), devoted to the impact of high performance computing and communications on computer simulations.

Advances in multicore and many-core architectures, networking, high end computers, large data stores, and middleware capabilities are ushering in a new era of high performance parallel and distributed simulations. Along with these new capabilities come new challenges in computing and system modeling. The goal of HPC 2017 is to encourage innovation in high performance computing and communication technologies and to promote synergistic advances in modeling methodologies and simulation. It will promote the exchange of ideas and information between universities, industry, supercomputing centers, and national laboratories about new developments in system modeling, high performance computing and communication, scientific computing as well as simulation.

Topics of interest include but are not limited to:

  • High performance computing issues in Big Data analytics
  • High performance/large scale application case studies
  • GPU for general purpose computations (GPGPU)
  • Accelerator and co-processor computing
  • Multicore and many-core computing
  • Exascale challenges
  • Cloud, distributed, and grid computing
  • Hybrid parallel or distributed algorithms
  • Large scale visualization and data management
  • Parallel algorithms and architectures
  • High performance software tools and techniques
  • Resilience at the simulation level
  • Component technologies for high performance computing

Special Session on Hardware-Software Co-Design for HPC (Co-HPC)

The purpose of this special session is to bring together researchers investigating the interrelationships between applications, systems software, and hardware, including methodologies and tools for hardware-software co-design for HPC. We also seek submissions that demonstrate collaboration between domain scientists, applied mathematicians, computer scientists, and hardware architects.

Topics of interest include, but are not limited, to the following:

  • Use of simulation and emulation techniques for co-design
  • Power-aware applications
  • Co-optimization for multiple objectives (such as performance, power, resilience)
  • Evaluation of new processor and memory technologies for scientific applications
  • Mapping of algorithms and applications to heterogeneous systems

In case you are submitting to this special session, please make sure to select Co-HPC Special Session as the primary area of your paper.

PAPER SUBMISSIONS

Contributed papers are maximum 12 pages long with single column format (5 pages at minimum). They will be peer reviewed and - if accepted and presented at the conference - submitted to the ACM Digital Library. Papers must not have appeared before (or be pending) in a journal or conference with published proceedings, nor may they be under review or submitted to another forum during SpringSim'17 review process. At least one author of an accepted paper must register for the symposium and must present the paper at the symposium. There is also a possibility to submit to Work in Progress or Posters tracks; more details will be announced on the website. All submissions will be peer reviewed and feedback will be provided.

Papers should be submitted electronically using the SpringSim paper submission system for HPC 2017. The submission of full papers is open also to authors who did not previously submit an abstract. Please, use the new paper kit.

In case you are submitting to the Special Session on Hardware-Software Co-Design for HPC, please make sure to select Co-HPC Special Session as the primary area of your paper.

TUTORIALS, PANELS, AND SPECIAL SESSIONS

Proposals for tutorials, panels, and special sessions are welcome; submit such proposals to the general or program chairs by October 31, 2016. Early submissions are appreciated.

PUBLICATION

The symposium proceedings will be published in hard copy, on USB flash drive through SCS and in the ACM Digital Library.

BEST PAPER AWARD

At least one paper from each symposium will be chosen for a Best Paper Award, which will be recognized in an awards ceremony before a plenary lecture. The last year's award winners are listed at the HPC 2016 website.

SYMPOSIUM ORGANIZERS

General Chair Lukas Polok, Brno University of Technology, Czech Republic
General Vice-Chair Masha Sosonkina, Old Dominion University, USA
Program Chair William Thacker, Winthrop University, USA
Program Vice-Chair Josef Weinbub, TU Wien, Austria
Publicity Chair Karl Rupp, Freelance Computational Scientist

General Chair Josef Weinbub, TU Wien, Austria
General Vice-Chair Marc Baboulin, Inria Saclay & University of Paris-Sud, France
Program Chair William Thacker, Winthrop University, USA
Program Vice-Chair Lukas Polok, Brno University of Technology, Czech Republic
Publicity Chair Sanjukta Bhowmick, University of Nebraska, USA

STEERING COMMITTEE

Jack Dongarra University of Tennessee & Oak Ridge National Laboratory, USA
Fang “Cherry” Liu Georgia Institute of Technology, USA
Layne T. Watson Virginia Polytechnic Institute and State University, USA

PROGRAM COMMITTEE

Mario AntoniolettiEPCC, UK
Hartwig AnztUniversity of Tennessee, USA
Alex AravindUniversity of Northern British Columbia, Canada
Eric AubanelUniversity of New Brunswick, Canada
Jordi BlascoNew Zealand eScience Infrastructure, New Zealand & HPCNow!, Spain
Jordi BlascoHPCNow!, Spain - NeSI, New Zealand
Brett BodeNational Center for Supercomputing Applications, USA
Bruno CarpentieriNottingham Trent University, School of Science and Technology
Laura CarringtonSan Diego Supercomputer Center, USA
Jing-Ru C. "Ruth" ChengU.S. Army Research and Development Center
Frédéric DesprezINRIA, France
Kapil DevNVIDIA, USA
Peng DuMicrosoft, USA
Norbert EickerJülich Research Centre, Germany
Nahid EmadUniversity of Versailles, France
Rui FanNanyang Technological University, Singapore
Samantha FoleyUniversity of Wisconsin-La Crosse, USA
Apala GuhaIndraprastha Institute of Information Technology, India
Georg HagerUniversity Erlangen-Nuremberg, Germany
Azzam HaidarUniversity of Tennessee, USA
Phillip HammondsNorthrop Grumman, USA
Christopher HarrisPawsey Supercomputing Centre & iVEC, Australia
Gary HowellNorth Carolina State University, USA
Saurabh HukerikarOak Ridge National Laboratory, USA
Jim JonesFlorida Institute of Technology, USA
Michael KlemmIntel, USA
Matthew KnepleyRice University, USA
Tan LiVMware Inc., USA
Piotr LuszczekUniversity of Tennessee, USA
Azamat MametjanovArgonne National Laboratory, USA
Michael MascagniFlorida State University, USA
Gabriel MateescuVirginia Polytechnic Institute and State University, USA
Christian PerezINRIA, France
Rhonda PhillipsTrue Fit, USA
Thomas RauberUniversity of Bayreuth, Germany
Jill ReeseAppalachian State University, USA
Hayk ShoukourianLeibniz Supercomputing Centre, Germany
Steve StevensonClemson University, USA
Alan StewartUniversitat Politecnica de Catalunya, Spain
Massimo TorquatiUniversity of Pisa, Italy
Jesper Larsson TräffTU Wien, Austria
William A. WardCSC, USA
Qin XinUniversity of the Faroe Islands, Faroe Islands
Yaxiong ZhaoGoogle