Innovation of technical equipment for multilayer printed circuit boards

Czech title:Inovace výrobní linky pro tvorbu vícevrstvých desek plošných spojů
Reseach leader:Otáhal Alexandr (FEKT VUT)
Team leaders:Crha Adam, Růžička Richard
Team members:Szendiuch Ivan
Agency:Brno University of Technology
Keywords:Printed circuit board, through-hole plating, fine pitch applications.
The aim of the project is to innovate the process of through-hole copper plating of a PCB to ensure stable quality of results and lower the power consumption.


2016OTÁHAL Alexandr, ŠIMEK Václav, CRHA Adam, RŮŽIČKA Richard and SZENDIUCH Ivan. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica Electrical Engineering and Computer Science. Budapest: Budapest University of Technology and Economics, 2016, vol. 60, no. 4, pp. 217-222. ISSN 2064-5279.

Your IPv4 address:
Switch to IPv6 connection

DNSSEC [dnssec]