Conference paper

 
Malčík, D.: Mikroskopická analýza čipů, In: Proceedings of the 17th Conference STUDENT EEICT 2011, Brno, CZ, FIT VUT, 2011, p. 306-308, ISBN 978-80-214-4272-6
Publication language:czech
Original title:Mikroskopická analýza čipů
Title (en):Microscopic Analysis of The Chips
Pages:306-308
Proceedings:Proceedings of the 17th Conference STUDENT EEICT 2011
Conference:Student EEICT 2011
Place:Brno, CZ
Year:2011
ISBN:978-80-214-4272-6
Publisher:Faculty of Information Technology BUT
URL:http://www.feec.vutbr.cz/EEICT/2011/sbornik/02-Magisterske%20projekty/10-Pocitacove%20systemy/05-xmalci00.pdf [PDF]
Keywords
microscope, chip, chip package, leadframe, decapsulation, bare chip, analysis of chips
Annotation
These days many different types of chips are used virtually everywhere. Sometimes, it is necessary that a certain chip meets specific security requirements. For this reason it is essential to examine various properties of chips; one of those can be a chip security with respect to its physical structure. This paper provides description of the chip decapsulation process. The presented process can be used to obtain bare chips for further analysis.
BibTeX:
@INPROCEEDINGS{
   author = {Dominik Malčík},
   title = {Mikroskopická analýza čipů},
   pages = {306--308},
   booktitle = {Proceedings of the 17th Conference STUDENT EEICT 2011},
   year = {2011},
   location = {Brno, CZ},
   publisher = {Faculty of Information Technology BUT},
   ISBN = {978-80-214-4272-6},
   language = {czech},
   url = {http://www.fit.vutbr.cz/research/view_pub.php?id=9864}
}