Department of Computer Systems

Journal article

OTÁHAL Alexandr, ŠIMEK Václav, CRHA Adam, RŮŽIČKA Richard and SZENDIUCH Ivan. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica Electrical Engineering and Computer Science. Budapest: Budapest University of Technology and Economics, 2016, vol. 60, no. 4, pp. 217-222. ISSN 2064-5279. Available from:
Publication language:english
Original title:Innovative Methods in Activation Process of Through-hole Plating
Title (cs):Inovativní metody v procesu aktivace povrchu prokovovaných děr
Journal:Periodica Polytechnica Electrical Engineering and Computer Science, Vol. 60, No. 4, Budapest, HU
Plated-through holes, PCB activation, reverse pulse plating, vacuum, ultrasound.
This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.
   author = {Alexandr Ot{\'{a}}hal and V{\'{a}}clav {\v{S}}imek and Adam
	Crha and Richard R{\r{u}}{\v{z}}i{\v{c}}ka and Ivan
   title = {Innovative Methods in Activation Process of Through-hole
   pages = {217--222},
   journal = {Periodica Polytechnica Electrical Engineering and Computer
   volume = {60},
   number = {4},
   year = {2016},
   ISSN = {2064-5279},
   language = {english},
   url = {}

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