Publication Details

Temperature Stabilized Chip Expander

ŘEZNÍČEK Michal, BURŠÍK Martin, JANKOVSKÝ Jaroslav, ŠIMEK Václav and RŮŽIČKA Richard. Temperature Stabilized Chip Expander. In: Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition. Friedrichshafen: IMAPS-Deutschland e.V., 2015, pp. 1-6. ISBN 978-0-9568086-1-5.
Czech title
Teplotně stabilizovaný čip expandér
Type
conference paper
Language
english
Authors
Keywords

Ceramic, substrate, chip expander, polymorphic chip, temperature stabilization.

Abstract

For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins.

Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4).

The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

Published
2015
Pages
1-6
Proceedings
Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition
Conference
20th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, DE
ISBN
978-0-9568086-1-5
Publisher
IMAPS-Deutschland e.V.
Place
Friedrichshafen, DE
DOI
UT WoS
000380428600016
EID Scopus
BibTeX
@INPROCEEDINGS{FITPUB10898,
   author = "Michal \v{R}ezn\'{i}\v{c}ek and Martin Bur\v{s}\'{i}k and Jaroslav Jankovsk\'{y} and V\'{a}clav \v{S}imek and Richard R\r{u}\v{z}i\v{c}ka",
   title = "Temperature Stabilized Chip Expander",
   pages = "1--6",
   booktitle = "Proceedings on 20th European Microelectronics and Packaging Conference \& Exhibition",
   year = 2015,
   location = "Friedrichshafen, DE",
   publisher = "IMAPS-Deutschland e.V.",
   ISBN = "978-0-9568086-1-5",
   doi = "10.13140/RG.2.1.1154.4084",
   language = "english",
   url = "https://www.fit.vut.cz/research/publication/10898"
}
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